DEK batch extrusion printing process

DEK, a supplier of high-precision bulk extrusion printing solutions, has announced that it has successfully applied bulk extrusion printing technology to improve the uniform coating of Thermal Interface Material (TIM) between semiconductor wafers and its encapsulation. Sex. Employing DEK's ProFlow DirEKt Imaging technology to emboss the TIM ensures that the thickness of the TIM material coated on the entire surface of the wafer is consistent, and provides better thermal conductivity between the silicon and the encapsulation, thereby improving the reliability of the package. The coplanarity of the enclosure.

Rich Heimsch, president of DEK International, stated: "For the coating of TIM materials, the controllability and repeatability of bulk extrusion printing technology is much better than that of conventional dispensing technology. In addition, DEK's imprinting process can be used for placement. The uniformity of the material coating and the absence of voids are easy to check before encapsulating the hood. This latest semiconductor manufacturing solution further demonstrates the versatility and value of bulk stamping technology in the packaging industry."

In the DEK TIM process, the die is mounted on a substrate and fed into a flexible printing system that combines three processes on a single platform: passive component attachment, TIM coating, and encapsulation cover heat sealing. The use of this printing system allows users greater flexibility in re-deploying the equipment between different processes to meet changing manufacturing needs, while at the same time achieving effective single-platform operator training.

Compared with the conventional sequential dispensing process, the parallel batch imprinting process can increase the true yield and enhance the control of the amount of material applied. This technique also allows for precise control of the shape of the TIM material coating on the entire die surface and improves its repeatability and uniformity. Since this process eliminates the need to use a housing to brush the TIM material, defects such as material voids and missing paint can be avoided. This is important for semiconductor manufacturers and packaging specialists because once the encapsulation is placed These defects are difficult to detect.

Heimsch concludes: “As the device becomes smaller and smaller, the effective application of TIM materials for heat dissipation becomes more important. DEK's TIM solution is only one of the methods used in the batch extrusion printing process to meet the constant Changing semiconductor packaging market demand."

Reprinted from: Ke Yin Network