The difference between high and low temperature test chamber and thermal shock test chamber
First, the cooling process: Both test chambers are high and low temperature tests for the industry. However, one of the most fundamental differences is that the high and low temperature test chambers are designed to sense the change of the industry during the cooling process. The thermal shock test chamber does not have this cooling process. It is the temperature sensing of the industry. Transformed and transformed. II: Scope of application: High and low temperature test chambers are used for the adaptability test of electrician, electronics industry, components, parts and materials in storage, transportation and use under high and low temperature environment, and temperature gradual test. Stress screening tests can also be performed on electronic components. The thermal shock test chamber is mainly used for the cold test of the electrical and electronic industry and parts, and the adaptability test box under the condition of rapid temperature change or gradual change. It is especially suitable for environmental stress screening (ESS) in the electrical and electronic industries. test. The test equipment is mainly used to carry out environmental simulation tests on the physical and other related characteristics of the industry under the conditions of high temperature and low temperature transient transformation according to the requirements of the national standards or the user's own requirements. After the test, the industry is judged by testing. Performance, whether it can still meet the predetermined requirements for industrial design, improvement, identification and factory inspection. Third, the temperature conversion speed: the temperature cycle test box relative conversion speed is slow, due to the diversity of test requirements, manufacturers will manufacture a variety of non-standard industries according to customer requirements, different configuration requirements speed is not the same, you please before buying First, explain the situation and requirements with the manufacturer, or make a more economical conventional machine with a temperature rise and fall speed of about 1 to 3 degrees / minute. The conventional high and low temperature box (such as BE-TH-80) is heated at 3 degrees per minute, and once cooled. The temperature conversion speed of the thermal shock test chamber per minute is very fast. Generally, the conversion time from the highest temperature to the lowest temperature can be completed within 3 to 5 minutes. It is also called the high and low temperature impact test chamber or the rapid temperature and temperature change test chamber. The conventional thermal shock test chamber (such as BE-CH-80) quickly completes the conversion from high temperature to normal temperature or normal temperature to low temperature within 5 minutes. The most essential difference is that the time taken for temperature change is different. 4. Humidity: The thermal shock test chamber has no humidity, and the temperature cycle test chamber can be selected for humidity test. Hongzhan has a research institute specializing in the research and development of environmental test equipment. It has mature loop test development methods and laboratories, and gathers a group of outstanding talents and well-known experts in the industry. The strong R&D team leads the domestic loop test technology. Development direction. At present, the company has high and low temperature test chambers with independent intellectual property rights, high and low temperature wet heat test chambers, rapid temperature change test chambers, thermal shock test chambers, three comprehensive test chambers, high and low temperature low pressure test chambers, solar radiation test chambers. The climatic environment test equipment and customized products such as industrial ovens and walk-in high and low temperature damp heat test chambers and high wind speed rain test chambers are at the leading domestic level and international high standards. Silicone Tags
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